The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Aug. 01, 2016
Applicant:
SK Hynix Inc., Icheon-si, Gyeonngi-do, KR;
Inventors:
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 29/792 (2006.01); H01L 29/66 (2006.01); H01L 29/788 (2006.01); H01L 21/764 (2006.01); H01L 27/115 (2017.01); H01L 27/11556 (2017.01); H01L 27/11565 (2017.01); H01L 27/11582 (2017.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 27/11517 (2017.01); H01L 27/11563 (2017.01); H01L 27/11519 (2017.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 21/764 (2013.01); H01L 21/7682 (2013.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53266 (2013.01); H01L 27/11517 (2013.01); H01L 27/11556 (2013.01); H01L 27/11563 (2013.01); H01L 27/11565 (2013.01); H01L 27/11582 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 29/7889 (2013.01); H01L 29/7926 (2013.01); H01L 27/11519 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device may include pillars and a plurality of conductive layers being stacked while surrounding the pillars and including a plurality of first regions including non-conductive material layers and a plurality of second regions including conductive material layers, wherein the first regions and the second regions are alternately arranged.