The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Dec. 25, 2014
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, CN;

Inventors:

Wei Fu, Shenzhen, CN;

Yu Yeh Chen, Shenzhen, CN;

Yin Hung Chen, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); G11C 8/12 (2006.01); H01L 23/498 (2006.01); G02F 1/133 (2006.01); G02F 1/1333 (2006.01); G02F 1/136 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); G02F 1/133 (2013.01); G02F 1/136 (2013.01); G02F 1/133305 (2013.01); G02F 1/133345 (2013.01); H01L 23/4985 (2013.01); H01L 23/5387 (2013.01);
Abstract

In the technical field of liquid crystal technology, a chip on film unit is provided. The chip on film unit comprises a soft dielectric layer, a plurality of pins for input signals disposed on the dielectric layer, and a first drive circuit module and a second drive circuit module. The first drive circuit module is connected with at least a portion of the pins for the input signals, and cascade wires are disposed between the first drive circuit module and the second drive circuit module for transmitting cascade signals therebetween. The number of signal channels in each of the drive circuit modules can be half of that required by the entire chip on film. As a result, the signal channels are distributed in a plurality of drive circuit modules, and the thermal efficiency can be significantly improved.


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