The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Jul. 01, 2015
Applicant:
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd., Zhuhai, CN;
Inventors:
Dror Hurwitz, Zhuhai, CN;
Alex Huang, Zhuhai, CN;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/027 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0273 (2013.01); H01L 21/4846 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3135 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01L 23/49866 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 23/3114 (2013.01); H01L 23/49548 (2013.01); H01L 23/49586 (2013.01); H01L 23/544 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/37001 (2013.01);
Abstract
An embedded die package comprising a die having die contract pads in a passivation layer, the die contact pads being coupled to a first side of a feature layer by an adhesive layer, a layer of pillars extending from a second side of the feature layer, the die, feature layer and the layer of pillars being encapsulated by a dielectric material.