The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Dec. 11, 2015
Applicant:
Suss Microtec Photonic Systems Inc., Corona, CA (US);
Inventor:
Habib Hichri, Irvine, CA (US);
Assignee:
SUSS MicroTec Photonic Systems Inc., Corona, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); B23K 26/40 (2014.01); H01L 21/311 (2006.01); B23K 26/142 (2014.01); B23K 26/36 (2014.01); H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0206 (2013.01); B23K 26/142 (2015.10); B23K 26/36 (2013.01); B23K 26/40 (2013.01); H01L 21/02096 (2013.01); H01L 21/02354 (2013.01); H01L 21/31 (2013.01); H01L 21/31105 (2013.01); H01L 21/31127 (2013.01); H01L 21/31144 (2013.01);
Abstract
A method of removing post-laser debris from a wafer includes, for an embodiment, forming a sacrificial layer over a layer to be patterned, patterning the sacrificial layer and the layer to be patterned using laser ablation, and removing the sacrificial layer and debris deposited on the sacrificial layer with water. The sacrificial layer includes a water soluble binder and a water soluble ultraviolet (UV) absorbent. Systems for removing the post-laser debris are also described.