The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Jun. 15, 2015
Applicant:

Koa Corporation, Ina-shi, Nagano, JP;

Inventors:

Takahiro Ishikawa, Ina, JP;

Hiroshi Ichikawa, Ina, JP;

Chika Ito, Ina, JP;

Assignee:

KOA CORPORATION, Ina-shi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 85/04 (2006.01); H01H 85/20 (2006.01); H01H 85/06 (2006.01); H01H 85/046 (2006.01); H01H 69/02 (2006.01); H01H 85/18 (2006.01); H01H 85/041 (2006.01);
U.S. Cl.
CPC ...
H01H 85/06 (2013.01); H01H 85/046 (2013.01); H01H 69/022 (2013.01); H01H 85/185 (2013.01); H01H 2085/0414 (2013.01);
Abstract

A chip type fuse excellent in resistance to climate conditions, where the fuse is able to operate stably under high temperature and high humidity environments. The fuse includes an insulative substrate; an under-glass layer formed on the insulative substrate; a fuse element formed on the under-glass layer; a pair of electrodes formed at both end sides of the fuse element; and an over-glass layer covering at least a fusing section of the fuse element; wherein the fuse element includes a layer where a first metal layer and a second metal layer are piled up, and a barrier layer consisting of a third metal layer, which covers the first metal layer and the second metal layer with a width that is wider than the width of the first metal layer and the second metal layer. The third metal layer overwraps the second metal layer and the first metal layer.


Find Patent Forward Citations

Ishikawa, Takahiro. (2017). Chip type fuse (U.S. Patent No. 9779904). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9779904

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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