The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Oct. 11, 2013
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-Shi, Kyoto-fu, JP;

Inventors:

Hiroyuki Harada, Nagaokakyo, JP;

Masaharu Itaya, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 11/14 (2013.01); H01G 11/80 (2013.01); H01G 11/82 (2013.01); H01G 11/74 (2013.01);
U.S. Cl.
CPC ...
H01G 11/74 (2013.01); H01G 11/80 (2013.01); H01G 11/82 (2013.01); Y02E 60/13 (2013.01);
Abstract

An electronic component includes an external terminal member made of a conductive metal and an insulating section in contact with the external terminal member. The external terminal member includes an exposed portion which faces outside and which is located on the predetermined surface side thereof. The electronic component is fixed with solder applied to the exposed portion of the external terminal member. The exposed portion of the external terminal member is given by a base plating film made of nickel or a nickel alloy and an outer plating film which is placed on the base plating film and which is made of gold, tin, or an alloy containing at least one of gold and tin. The outer plating film includes a relatively thick region and a relatively thin region surrounding the relatively thick region.


Find Patent Forward Citations

Loading…