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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9779880 B1

PDFFull Text
Date of Patent:
Oct. 03, 2017

Filed:

Aug. 30, 2016

Resin composition and dielectric layer and capacitor produced therefrom

Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Tao Cheng, Shanghai, CN;

Qilin Chen, Shanghai, CN;

Zhou Jin, Shanghai, CN;

Assignee:

3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);

Attorney:

Clifton F. Richardson

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B32B 15/092 (2006.01); B32B 27/20 (2006.01); B32B 27/38 (2006.01); H01G 4/20 (2006.01); C08L 63/00 (2006.01); C09D 163/00 (2006.01); H01G 9/07 (2006.01); H05K 1/03 (2006.01); C08K 3/24 (2006.01); C08K 7/08 (2006.01); C08K 7/14 (2006.01); H01G 9/042 (2006.01); H01G 9/055 (2006.01); H01G 9/15 (2006.01);
U.S. Cl.
CPC ...
H01G 9/07 (2013.01); C08K 3/24 (2013.01); C08K 7/08 (2013.01); C08K 7/14 (2013.01); H01G 4/203 (2013.01); H01G 9/042 (2013.01); H01G 9/055 (2013.01); H01G 9/15 (2013.01); H05K 1/0366 (2013.01); H05K 2201/0293 (2013.01);
Abstract

The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

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