The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Oct. 31, 2012
Applicant:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Inventors:

Khalil Najafi, Ann Arbor, MI (US);

Rebecca L. Peterson, Ann Arbor, MI (US);

Jae Yoong Cho, Ann Arbor, MI (US);

Zongliang Cao, Ann Arbor, MI (US);

Guohong He, Ann Arbor, MI (US);

Jeffrey Gregory, Burlington, MA (US);

Yi Yuan, Ann Arbor, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01C 19/5769 (2012.01); G01C 19/5712 (2012.01); G01C 19/574 (2012.01); G01P 15/08 (2006.01); G01P 15/097 (2006.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
G01C 19/5769 (2013.01); G01C 19/574 (2013.01); G01C 19/5712 (2013.01); G01P 15/0802 (2013.01); G01P 15/097 (2013.01); G01P 15/125 (2013.01);
Abstract

A microsystem includes a base layer formed from an electrical insulating material. The base layer has an inner surface defining a cavity and an external surface opposed to the inner surface, and in direct communication with an environment. A cap layer and a microelectromechanical (MEMS) device layer are formed from electrical insulating material or an other electrical insulating material. The cap has an inner surface defining a cavity, and an external surface opposed to the inner surface, and in direct communication with the environment. A MEMS device on/in the MEMS device layer is disposed between the base and the cap. Respective adjacent portions of the base, the cap and the device substrate are bonded to define an enclosed space. The enclosed space at least partially includes the base cavity or the cap cavity. At least a portion of a MEMS device on the device layer is in the enclosed space.


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