The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Feb. 27, 2013
Applicant:

Philips Lighting Holding B.v., Eindhoven, NL;

Inventors:

Rifat Ata Mustafa Hikmet, Eindhoven, NL;

Ties van Bommel, Eindhoven, NL;

Jianghong Yu, Eindhoven, NL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 99/00 (2016.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01); F21K 9/90 (2016.01); F21V 19/00 (2006.01); F21V 23/06 (2006.01); F21K 9/23 (2016.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); F21S 8/06 (2006.01); F21Y 101/00 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21K 9/13 (2013.01); F21K 9/23 (2016.08); F21K 9/90 (2013.01); F21V 19/002 (2013.01); F21V 23/06 (2013.01); H01L 25/0753 (2013.01); H01L 33/641 (2013.01); F21S 8/06 (2013.01); F21Y 2101/00 (2013.01); F21Y 2115/10 (2016.08); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/644 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

A lighting module () and a method () of manufacturing a lighting module, wherein the method comprises the steps of providing a heat sink material () in a fluid state and providing a light-source assembly () comprising a plurality of light sources () being electrically connected to a carrier (), wherein each of the light sources has a light-emitting surface (). The method further comprises the steps of embedding () the light-source assembly into the heat sink material such that the carrier and a part of each of the light sources are covered by the heat sink material while the light-emitting surface of each of the light sources is uncovered by the heat sink material, and solidifying () the heat sink material.


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