The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Jul. 06, 2016
Applicant:
Board of Regents, the University of Texas System, Austin, TX (US);
Inventors:
Assignee:
Board of Regents, The University of Texas System, Austin, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); C23C 18/16 (2006.01); B29C 67/00 (2017.01); H05K 3/10 (2006.01); H05K 3/42 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1641 (2013.01); B29C 67/0066 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); H05K 3/105 (2013.01); H05K 3/422 (2013.01); B29K 2995/0006 (2013.01); B29L 2031/3425 (2013.01); H05K 3/426 (2013.01); H05K 3/429 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0759 (2013.01); H05K 2203/107 (2013.01);
Abstract
A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.