The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Mar. 19, 2012
Applicants:

Seh-kwang Lee, Yongin-si, KR;

Rak-joo Sung, Hwaseong-si, KR;

Sang-wook Park, Seoul, KR;

Inventors:

Seh-Kwang Lee, Yongin-si, KR;

Rak-Joo Sung, Hwaseong-si, KR;

Sang-Wook Park, Seoul, KR;

Assignee:

EHWA DIAMOND INDUSTRIAL CO., LTD., Osan-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 18/00 (2006.01); B23D 61/18 (2006.01); B23D 65/00 (2006.01); C25D 5/02 (2006.01); B25D 13/00 (2006.01); C25D 15/00 (2006.01); C25D 13/00 (2006.01); C25D 7/06 (2006.01);
U.S. Cl.
CPC ...
B24D 18/0018 (2013.01); B23D 61/185 (2013.01); B23D 65/00 (2013.01); C25D 5/022 (2013.01); C25D 7/0607 (2013.01); C25D 13/00 (2013.01); C25D 15/00 (2013.01);
Abstract

The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.


Find Patent Forward Citations

Loading…