The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Nov. 17, 2015
Applicant:
Hakko Corporation, Osaka, JP;
Inventor:
Toshikazu Mochizuki, Osaka, JP;
Assignee:
Hakko Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 1/018 (2006.01);
U.S. Cl.
CPC ...
B23K 1/018 (2013.01);
Abstract
The object of the invention is to provide a nozzle for a desoldering tool that facilitates the removal of solder from components having a large difference between the width and thickness dimensions of the solder connection. The present application discloses a nozzle for use with a desoldering tool for melting and sucking solder away. The nozzle includes a distal end surface which is heated to a temperature melting the solder. The distal end surface, as an upstream end of a molten solder suction path, defines a non-circular elongated generally oval shaped opening.