The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Oct. 01, 2013
Applicant:

Globalfoundries Inc., Grand Cayman, KY (US);

Inventors:

Stephen P. Ayotte, Bristol, VT (US);

Glen E. Richard, Essex Junction, VT (US);

Timothy D. Sullivan, Underhill, VT (US);

Timothy M. Sullivan, Essex Junction, VT (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); B23K 1/002 (2006.01); B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/002 (2013.01); B23K 1/0016 (2013.01); H05K 3/3494 (2013.01); H05K 3/3436 (2013.01); H05K 2203/101 (2013.01); Y10T 29/49144 (2015.01); Y10T 29/53178 (2015.01);
Abstract

Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.


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