The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Mar. 04, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Satoshi Abe, Osaka, JP;

Masataka Takenami, Aichi, JP;

Isamu Matsumoto, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/16 (2006.01); B22F 3/105 (2006.01); B33Y 30/00 (2015.01); B29C 67/00 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2015.01); B23K 26/082 (2014.01); B23K 26/342 (2014.01); B22F 3/24 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B23K 26/082 (2015.10); B23K 26/342 (2015.10); B29C 67/0077 (2013.01); B29C 67/0092 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B22F 2003/1056 (2013.01); B22F 2003/1057 (2013.01); B22F 2003/247 (2013.01); B22F 2998/10 (2013.01); B23K 2203/42 (2015.10); Y02P 10/295 (2015.11);
Abstract

A selective laser sintering method reduces a warping deformation of a three-dimensional shaped object, the warping deformation being due to the scanning of a light beam. The manufacturing method is a method for manufacturing a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming, wherein a scanning of the light irradiation is divided into light beam-scannings 'A' and 'B', the light beam-scanning “A” being for the light irradiation of a peripheral portion corresponding to a periphery of the three-dimensional shaped object, and the light beam-scanning “B” being for the light irradiation of an internal portion corresponding to a region of the three-dimensional shaped object, the region being located inside the periphery. In particular, the peripheral portion is subjected to a discontinuous light beam-irradiation in the light beam-scanning “A” such that an irradiation path of the light beam is divided into a plurality of sub-irradiation paths.


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