The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Apr. 07, 2015
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Tatsuya Arisawa, Fukushima, JP;
Yoshihiko Nakamura, Fukushima, JP;
Tomoyuki Abe, Fukushima, JP;
Kiyotaka Komori, Mie, JP;
Syouji Hasimoto, Fukushima, JP;
Mitsuyoshi Nishino, Fukushima, JP;
Abstract
A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m/g to 15 m/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.