The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Aug. 03, 2016
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Hideto Motomura, Kyoto, JP;
Hiroyuki Mori, Osaka, JP;
Hiroshi Matsumoto, Kanagawa, JP;
Katsuya Watanabe, Tokyo, JP;
Kiminori Mizuuchi, Saitama, JP;
Naoki Matsubara, Tokyo, JP;
Assignee:
PANSONIC CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); G01N 1/28 (2006.01); G01N 21/27 (2006.01); G02B 21/36 (2006.01); H01L 31/0203 (2014.01); G01N 1/31 (2006.01); H04N 5/32 (2006.01); H01L 27/146 (2006.01); H04N 5/378 (2011.01); G02B 21/00 (2006.01); G02B 21/34 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2253 (2013.01); G01N 1/28 (2013.01); G01N 1/312 (2013.01); G01N 21/27 (2013.01); G02B 21/0008 (2013.01); G02B 21/36 (2013.01); G02B 21/362 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H01L 31/0203 (2013.01); H04N 5/2251 (2013.01); H04N 5/2254 (2013.01); H04N 5/32 (2013.01); H04N 5/378 (2013.01); G02B 21/34 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/16152 (2013.01);
Abstract
A preparation includes an image sensor, a package, and a transparent plate. The image sensor has an imaging area on a front surface. The package is electrically connected to the image sensor. The transparent plate opposes the front surface of the image sensor with a mounting medium interposed therebetween. On the surface of the transparent plate, first and second grooves are formed. The image sensor is disposed between the first and second grooves.