The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

May. 20, 2015
Applicant:

Google Inc., Mountain View, CA (US);

Inventors:

Peter Bevelacqua, Mountain View, CA (US);

Jason Chamberlain, Campbell, CA (US);

Assignee:

Google Inc., Mountain View, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H01Q 7/00 (2006.01); H01Q 1/38 (2006.01); H05K 1/02 (2006.01); H04B 5/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 7/00 (2013.01); H01Q 1/38 (2013.01); H04B 5/0081 (2013.01); H05K 1/0296 (2013.01); H05K 3/32 (2013.01); H04B 5/0056 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09972 (2013.01); H05K 2201/10098 (2013.01);
Abstract

Systems and techniques are provided for a co-located NFC reader. A top conductive layer may include an inner PCB section, including a circuit for an electronic device, and an outer PCB section, including a near-field communications (NFC) chipset, separated by a gap in which an NFC antenna connected to the NFC chipset may be located. A substrate layer may include an inner PCB section and an outer PCB section separated by the gap. A bridge including a trace may cross the gap. A lower conductive layer may include an inner PCB section, including a circuit for the electronic device electrically connected to the circuit for the electronic device located on the inner PCB section of the top conductive layer, and an outer PCB section, including a circuit for the electronic device, separated by the gap.


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