The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Sep. 11, 2014
Applicant:

National University Corporation Yamagata University, Yamagata-shi, Yamagata, JP;

Inventors:

Daisuke Kumaki, Yamagata, JP;

Tomohito Sekine, Yamagata, JP;

Shizuo Tokito, Yamagata, JP;

Kenjiro Fukuda, Yamagata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); B22F 3/10 (2006.01); B22F 1/00 (2006.01); B22F 7/04 (2006.01); H01L 51/05 (2006.01); C23C 24/10 (2006.01); H05K 3/12 (2006.01); H01L 51/00 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H01L 51/055 (2013.01); B22F 1/0018 (2013.01); B22F 3/1017 (2013.01); B22F 7/04 (2013.01); C23C 24/106 (2013.01); H01L 51/0021 (2013.01); H01L 51/0545 (2013.01); H05K 3/1208 (2013.01); H05K 1/036 (2013.01); H05K 1/0393 (2013.01); H05K 1/097 (2013.01); H05K 3/381 (2013.01);
Abstract

The metal thin film production method of the present invention includes, in the following order, the steps of: preparing a substrate () having thereon an underlayer () formed of an insulating resin; subjecting a surface of the underlayer () to a physical surface treatment for breaking bonds of organic molecules constituting the insulating resin; subjecting the substrate () to a heat treatment at a temperature of 200° C. or lower; applying a metal nanoparticle ink to the underlayer (); and sintering metal nanoparticles contained in the metal nanoparticle ink at a temperature equal to or higher than a glass transition temperature of the underlayer (). A fused layer () having a thickness of 100 nm or less is formed between the underlayer () and a metal thin film () formed by sintering the metal nanoparticles.


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