The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Apr. 05, 2013
Applicant:
Ctlab Co., Ltd., Gyeonggi-do, KR;
Inventors:
Chang Tae Kim, Gyeonggi-do, KR;
Jae Sung Ko, Gyeonggi-do, KR;
Seok Jung Kim, Gyeonggi-do, KR;
Chang Hun Lee, Gyeonggi-do, KR;
Assignee:
CTLAB CO. LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); H01L 33/46 (2010.01); H01L 33/52 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/42 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/46 (2013.01); H01L 33/42 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/644 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 2224/48091 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01);
Abstract
The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material.