The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Nov. 16, 2015
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventor:
Hayato Nakano, Kofu, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/12 (2006.01); H01L 31/173 (2006.01); H01L 31/153 (2006.01); H01L 29/78 (2006.01); H01L 29/16 (2006.01); H01L 31/14 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 33/34 (2010.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 31/12 (2013.01); H01L 25/167 (2013.01); H01L 29/1608 (2013.01); H01L 29/7827 (2013.01); H01L 31/14 (2013.01); H01L 31/153 (2013.01); H01L 31/173 (2013.01); H01L 33/0033 (2013.01); H01L 33/0041 (2013.01); H01L 33/32 (2013.01); H01L 33/34 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12032 (2013.01);
Abstract
A semiconductor device is provided, which has a wide-bandgap semiconductor element, such as a SiC element, and which includes a sensor capable of responding sufficiently to characteristic requirements for protecting and controlling the semiconductor element. The semiconductor device includes a wide-bandgap semiconductor element mounted on a substrate; and a light-receiving element that receives light emitted from the wide-bandgap semiconductor element when the wide-bandgap semiconductor element is in a conduction state.