The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Apr. 20, 2016
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Balaji Padmanabhan, Tempe, AZ (US);

Prasad Venkatraman, Gilbert, AZ (US);

Peter Moens, Erwetegem, BE;

Mihir Mudholkar, Tempe, AZ (US);

Joe Fulton, Chandler, AZ (US);

Philip Celaya, Gilbert, AZ (US);

Stephen St. Germain, Scottsdale, AZ (US);

Chun-Li Liu, Scottsdale, AZ (US);

Jason McDonald, Scottsdale, AZ (US);

Alexander Young, Scottsdale, AZ (US);

Ali Salih, Mesa, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 29/747 (2006.01); H01L 29/74 (2006.01); H01L 23/495 (2006.01); H01L 29/205 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/778 (2006.01); H01L 25/11 (2006.01); H03K 17/687 (2006.01); H01L 23/00 (2006.01); H01L 27/088 (2006.01); H01L 21/8258 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/747 (2013.01); H01L 23/4952 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/40 (2013.01); H01L 25/115 (2013.01); H01L 29/205 (2013.01); H01L 29/404 (2013.01); H01L 29/4238 (2013.01); H01L 29/742 (2013.01); H01L 29/7416 (2013.01); H01L 29/7786 (2013.01); H01L 29/7787 (2013.01); H03K 17/6874 (2013.01); H01L 21/8258 (2013.01); H01L 27/0629 (2013.01); H01L 27/088 (2013.01); H01L 27/0883 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/73221 (2013.01); H03K 2017/6878 (2013.01); H03K 2217/0009 (2013.01); H03K 2217/0018 (2013.01);
Abstract

A half-bridge circuit can include a high-side HEMT, a high-side switch transistor, a low-side HEMT, and a low-side switch transistor. The die substrates of the HEMTs can be coupled to the sources of their corresponding switch transistors. In another aspect, a packaged electronic device for a half-bridge circuit can have a design that can use shorter connectors that help to reduce parasitic inductance and resistance. In a further aspect, a packaged electronic device for a half-bridge circuit can include more than one connection along the bottom of the package allows less lead connections along the periphery of the packaged electronic device and can allow for a smaller package.


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