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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9773767 B1

PDFFull Text
Date of Patent:
Sep. 26, 2017

Filed:

Sep. 10, 2015

Semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Yoko Nakamura, Matsumoto, JP;

Norihiro Nashida, Nagano, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Yuriy Semenenko

Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/40 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 24/01 (2013.01); H01L 24/33 (2013.01); H01L 25/072 (2013.01); H05K 1/0263 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 23/49844 (2013.01); H01L 24/32 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32258 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/153 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/30107 (2013.01); H05K 1/144 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10242 (2013.01);
Abstract

A semiconductor device includes an insulating substrate including an insulating plate and a circuit plate disposed on a main surface of the insulating plate; a semiconductor chip having a front surface provided with an electrode and a rear surface fixed to the circuit plate; a printed circuit board facing the insulating substrate and including a metal layer; a conductive post having one end electrically and mechanically connected to the electrode and another end electrically and mechanically connected to the metal layer; a passive element fixed to the printed circuit board; and a plurality of positioning posts fixed to the printed circuit board to position the passive element.

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