The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Jul. 20, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
John U. Knickerbocker, Monroe, NY (US);
Shriya Kumar, New York, NY (US);
Jae-Woong Nah, Closter, NJ (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/89 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/64 (2013.01); H01L 24/69 (2013.01); H01L 24/83 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/325 (2013.01); H01L 2224/32111 (2013.01); H01L 2224/32235 (2013.01); H01L 2224/64 (2013.01); H01L 2224/69 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/89 (2013.01); H01L 2924/014 (2013.01); H01L 2924/15332 (2013.01);
Abstract
A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.