The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Jan. 24, 2013
Applicant:

Luxvue Technology Corporation, Santa Clara, CA (US);

Inventors:

Andreas Bibl, Los Altos, CA (US);

John A. Higginson, Santa Clara, CA (US);

Hsin-Hua Hu, Los Altos, CA (US);

Hung-Fai Stephen Law, Los Altos, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 5/22 (2006.01); B23K 31/02 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/75 (2013.01); H01L 24/95 (2013.01); H01L 21/67144 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29183 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75261 (2013.01); H01L 2224/75281 (2013.01); H01L 2224/75282 (2013.01); H01L 2224/75283 (2013.01); H01L 2224/75725 (2013.01); H01L 2224/83 (2013.01); H01L 2224/8383 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/83825 (2013.01); H01L 2224/83948 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1461 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.


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