The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Nov. 03, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Timothy D. Sullivan, Underhill, VT (US);

Thomas A. Wassick, LaGrangeville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01); G06F 17/50 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); G06F 17/5077 (2013.01); H01L 21/76898 (2013.01); H01L 22/14 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/647 (2013.01); H01L 24/10 (2013.01); H01L 25/0657 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/1413 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15788 (2013.01);
Abstract

Wiring structures, methods for providing a wiring structure, and methods for distributing currents with a wiring structure from one or more through-substrate vias to multiple bumps. A first current is directed from a first through-substrate via of a first electrical resistance through a first connection line to a first bump and directing a second current from the first through-substrate via through a second connection line of a second electrical resistance to a second bump. The first connection line has a first length relative to a first position of the first bump and a first cross-sectional area, the second connection line has a second length relative to a first position of the second bump and a second cross-sectional area, the second length is different from the first length, and the second cross-sectional area is different from the first cross-sectional area.


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