The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Apr. 06, 2016
Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Katsuhiko Yoshihara, Kyoto, JP;

Masao Saito, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4924 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 23/49506 (2013.01); H01L 23/49531 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 24/45 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/0503 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/0532 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05342 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/069 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A power module includes: an insulating layer; a first metallic plate disposed on the insulating layer; a first semiconductor chip disposed on the first metallic plate; a first adhesive insulating layer and a second adhesive insulating layer disposed on the first metallic plate; a first metallic land for main electrode wiring disposed on the first adhesive insulating layer; and a first metallic land for signal wiring disposed on the second adhesive insulating layer. There can be provided a power module having reduced cost, reduced warpage of the whole of a substrate, stabilized quality, and improved reliability; and a fabrication method for such a power module.


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