The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Apr. 10, 2014
Applicant:

Oracle International Corporation, Redwood City, CA (US);

Inventors:

David C. Douglas, Palo Alto, CA (US);

David W. Copeland, Mountain View, CA (US);

Bruce M. Guenin, San Diego, CA (US);

Assignee:

ORACLE INTERNATIONAL CORPORATION, Redwood Shores, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/427 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 21/4882 (2013.01); H01L 23/3672 (2013.01); H01L 23/42 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/16152 (2013.01);
Abstract

A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board.


Find Patent Forward Citations

Loading…