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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9773654 B1

PDFFull Text
Date of Patent:
Sep. 26, 2017

Filed:

Jan. 27, 2016

Fe-co-based alloy sputtering target material, and method of producing same

Applicant:

Hitachi Metals, Ltd., Minato-ku, Tokyo, JP;

Inventors:

Jun Fukuoka, Shimane, JP;

Kazuya Saito, Tokyo, JP;

Kouichi Sakamaki, Shimane, JP;

Tomoyuki Hata, Shimane, JP;

Assignee:

HITACHI METALS, LTD., Tokyo, JP;

Attorney:

SOLARIS Intellectual Property Group, PLLC

Primary Examiner:

John Brayton

Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); B22F 3/14 (2006.01); C22C 19/07 (2006.01); C22C 38/00 (2006.01); G11B 5/851 (2006.01); C23C 14/20 (2006.01); C22C 38/10 (2006.01); C22C 38/12 (2006.01); C22C 38/26 (2006.01); H01F 41/18 (2006.01); C22C 1/04 (2006.01); C22C 33/02 (2006.01); C22C 30/00 (2006.01); C23C 14/14 (2006.01); B22F 9/08 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3429 (2013.01); B22F 3/14 (2013.01); C22C 1/0433 (2013.01); C22C 19/07 (2013.01); C22C 30/00 (2013.01); C22C 33/0285 (2013.01); C22C 38/00 (2013.01); C22C 38/10 (2013.01); C22C 38/12 (2013.01); C22C 38/26 (2013.01); C23C 14/14 (2013.01); C23C 14/20 (2013.01); C23C 14/3414 (2013.01); G11B 5/851 (2013.01); H01F 41/183 (2013.01); B22F 9/082 (2013.01); C22C 2202/02 (2013.01); H01J 2237/02 (2013.01);
Abstract

Provided is a Fe—Co-based alloy sputtering target material having a composition represented as an atomic ratio by the compositional formula: (Fe—Co)—Ta—Nb-M, wherein 0<a≦80, 0≦b≦10, 0≦c≦15, 5≦b+c≦15, 2≦d≦20, 15≦b+c+d≦25, and M represents one or more elements selected from the group consisting of Mo, Cr and W, with the balance consisting of unavoidable impurities, wherein the sputtering target material has a bending fracture strain εat 300° C. of 0.4% or more.

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