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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9773527 B1

PDFFull Text
Date of Patent:
Sep. 26, 2017

Filed:

Mar. 13, 2015

Semiconductor device

Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Itaru Yamaguchi, Yokohama, JP;

Masaru Koyanagi, Ota, JP;

Hiroaki Nakano, Kawaguchi, JP;

Assignee:

TOSHIBA MEMORY CORPORATION, Minato-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Anthan Tran

Int. Cl.
CPC ...
G11C 8/00 (2006.01); G11C 5/02 (2006.01); G11C 8/12 (2006.01); G11C 16/20 (2006.01); H01L 25/065 (2006.01); G11C 5/14 (2006.01); H01L 23/31 (2006.01); G11C 29/44 (2006.01);
U.S. Cl.
CPC ...
G11C 5/025 (2013.01); G11C 8/12 (2013.01); G11C 16/20 (2013.01); G11C 5/148 (2013.01); G11C 2029/4402 (2013.01); H01L 23/3135 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/3303 (2013.01); H01L 2224/33051 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15311 (2013.01);
Abstract

According to one embodiment, electrodes are provided in stacked M (M is an integer of 2 or more) semiconductor chips, a transmission units are provided for the semiconductor chips and, based on a chip identification information on a semiconductor chip in the present stage, transmits the chip identification information on a semiconductor chip in the next stage via the electrodes, or transmit a data for setting the chip identification information, and the direction in which an external signal is sent via the electrodes is opposite to the direction in which the chip identification information is transmitted via the electrodes.

Find Patent Forward Citations

Yamaguchi, Itaru. (2017). Semiconductor device (U.S. Patent No. 9773527). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9773527

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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