The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Nov. 17, 2015
Teledyne Scientific & Imaging, Llc, Thousand Oaks, CA (US);
Bing-Chung Chen, Newbury Park, CA (US);
TELEDYNE SCIENTIFIC & IMAGING, LLC, Thousand Oaks, CA (US);
Abstract
A method of modeling the temperature profile of an IC transistor junction employs an efficient thermal simulation algorithm to implement a design tool for IC design applications. The junction area of a transistor is divided into an odd number of sub-sections of equal size. Each sub-section is modeled as an equivalent circular heat source having an area equal to that of a sub-section. Temperature profiles are determined for each of the equivalent circular heat sources, which are superimposed to provide a total thermal profile for the junction. The method is preferably employed with rectangular-shaped junction areas, and performed with a software-controlled microprocessor. The method may be integrated with an electronic circuit simulation program such as SPICE. The results of the modeling may be used to iteratively modify the component layout on an IC to improve its temperature performance and/or its component density.