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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9772447 B1

PDFFull Text
Date of Patent:
Sep. 26, 2017

Filed:

May. 06, 2016

Method for realizing heterogeneous iii-v silicon photonic integrated circuits

Applicants:

Imec Vzw, Leuven, BE;

Universiteit Gent, Ghent, BE;

Inventors:

Shahram Keyvaninia, Tehran, IR;

Dries Van Thourhout, Ledebeke, BE;

Gunther Roelkens, Schellebelle, BE;

Assignees:

IMEC VZW, Leuven, BE;

Universiteit Gent, Ghent, BE;

Attorney:

McDonnell Boehnen Hulbert & Berghoff LLP

Primary Examiner:

Robert Tavlykaev

Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/00 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01S 5/02 (2006.01); G02B 6/122 (2006.01); H01L 31/103 (2006.01); G02B 6/14 (2006.01); G02B 6/34 (2006.01); G02F 1/017 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12002 (2013.01); G02B 6/12004 (2013.01); G02B 6/1228 (2013.01); G02B 6/14 (2013.01); H01L 31/1035 (2013.01); H01S 5/0215 (2013.01); H01S 5/0218 (2013.01); G02B 6/12 (2013.01); G02B 6/34 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12078 (2013.01); G02B 2006/12107 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12123 (2013.01); G02B 2006/12142 (2013.01); G02F 1/01708 (2013.01);
Abstract

A method of producing a heterogeneous photonic integrated circuit includes integrating at least one III-V hybrid device on a source substrate having at least a top silicon layer, and transferring by transfer-printing or by flip-chip bonding the III-V hybrid device and at least part of the top silicon layer of the source substrate to a semiconductor-on-insulator or dielectric-on-insulator host substrate.

Find Patent Forward Citations

Keyvaninia, Shahram. (2017). Method for realizing heterogeneous iii-v silicon photonic integrated circuits (U.S. Patent No. 9772447). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9772447

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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