The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Apr. 25, 2013
Applicant:

Asia Vital Components Co., Ltd., Sinjhuang District, New Taipei, TW;

Inventor:

Hsiu-Wei Yang, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); F28D 15/04 (2006.01); F28D 15/02 (2006.01); F28F 1/32 (2006.01); H01L 23/427 (2006.01); H01L 23/367 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01); F28D 15/0275 (2013.01); F28F 1/32 (2013.01); H01L 23/427 (2013.01); H01L 23/3672 (2013.01); H01L 23/467 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.


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