The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Dec. 02, 2015
Applicant:

Lighting Science Group Corporation, Melbourne, FL (US);

Inventors:

Mark Boomgaarden, Satellite Beach, FL (US);

Richard LeClair, Indian Harbour Beach, FL (US);

Yong Jiang, Satellite Beach, FL (US);

Assignee:

Lighting Science Group Corporation, Cocoa Beach, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B60Q 1/00 (2006.01); F21V 29/70 (2015.01); F21S 8/02 (2006.01); F21V 21/04 (2006.01); F21V 29/508 (2015.01); F21V 29/87 (2015.01); F21V 23/00 (2015.01); F21V 21/02 (2006.01); F21V 23/02 (2006.01); F21V 31/00 (2006.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/70 (2015.01); F21S 8/026 (2013.01); F21V 21/041 (2013.01); F21V 29/508 (2015.01); F21V 29/87 (2015.01); F21V 21/02 (2013.01); F21V 23/006 (2013.01); F21V 23/026 (2013.01); F21V 31/005 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08);
Abstract

A luminaire comprising a housing formed of thermally conductive polymer with an optic carried thereby, a trim carried by the optic, and a light source. The light source may comprise an LED board comprising a copper layer and a plurality of light emitting diodes (LEDs) disposed on the LED board. The luminaire may also comprise control circuitry operably coupled to the plurality of LEDs, wherein the LED board is positioned in thermal communication with the housing. The luminaire may further comprise a mounting member configured to be attached to each of the housing and an external structure. The control circuitry may be configured to operate the plurality of LEDs such that heat generated by the plurality of LEDs is dissipated by the copper layer of the LED board.


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