The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Dec. 29, 2016
Applicant:
Empire Technology Development Llc, Wilmington, DE (US);
Inventors:
William Brenden Carlson, Seattle, WA (US);
Gregory David Phelan, Cortland, NY (US);
Vincenzo Casasanta, III, Woodinville, WA (US);
Feng Wan, Issaquah, WA (US);
Assignee:
Empire Technology Development LLC, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 7/28 (2006.01); C08K 7/22 (2006.01); C03C 11/00 (2006.01); C04B 38/00 (2006.01); C08F 110/02 (2006.01); C08F 112/08 (2006.01); C08F 120/14 (2006.01); C08G 59/02 (2006.01); C04B 41/80 (2006.01); C08F 8/00 (2006.01); C08F 290/04 (2006.01); C08K 7/26 (2006.01); C08K 9/06 (2006.01); C08F 292/00 (2006.01); C04B 28/00 (2006.01); C04B 28/04 (2006.01); C04B 28/14 (2006.01); C04B 28/24 (2006.01); C04B 14/24 (2006.01); C04B 20/02 (2006.01); C04B 111/72 (2006.01);
U.S. Cl.
CPC ...
C08K 7/28 (2013.01); C03C 11/002 (2013.01); C04B 14/24 (2013.01); C04B 20/02 (2013.01); C04B 28/005 (2013.01); C04B 28/04 (2013.01); C04B 28/14 (2013.01); C04B 28/24 (2013.01); C04B 38/009 (2013.01); C04B 41/80 (2013.01); C08F 8/00 (2013.01); C08F 110/02 (2013.01); C08F 112/08 (2013.01); C08F 120/14 (2013.01); C08F 290/042 (2013.01); C08F 292/00 (2013.01); C08G 59/02 (2013.01); C08K 7/22 (2013.01); C08K 7/26 (2013.01); C08K 9/06 (2013.01); C04B 2111/72 (2013.01); C08L 2205/20 (2013.01); Y10T 428/2982 (2015.01);
Abstract
Functionalized microspheres for being dispersed in matrix materials to reduce the density and weight of the materials may be configured to include a covalently bound surface component which is configured to covalently bond with the matrix material so that when combined with the matrix material a strong, light-weight matrix material may be produced.