The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Jun. 28, 2013
Applicant:
Kuraray Co., Ltd., Kurashiki-shi, JP;
Inventors:
Hiroyuki Konishi, Tainai, JP;
Takuro Niimura, Tainai, JP;
Atsushi Matsumura, Tainai, JP;
Hiroshi Ozawa, Tainai, JP;
Assignee:
KURARAY Co., Ltd., Kurashiki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08F 22/10 (2006.01); B29C 45/00 (2006.01); C08F 20/14 (2006.01); B29K 33/00 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
C08F 22/10 (2013.01); B29C 45/0001 (2013.01); C08F 20/14 (2013.01); B29K 2033/08 (2013.01); B29K 2033/12 (2013.01); B29L 2011/0075 (2013.01);
Abstract
A methacrylic resin composition, which comprises a methacrylic resin comprising 99.5% by mass or more of a structural unit derived from methyl methacrylate. The methacrylic resin includes less than 0.03 mol % of terminal double bonds based on the amount of the structural unit derived from methyl methacrylate and 0.2 mol % or more of combined sulfur atoms based on the amount of the structural unit derived from methyl methacrylate. The methacrylic resin composition has a melt flow rate of 8 g/10 min or more at 230° C. and a load of 3.8 kg.