The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Jan. 30, 2014
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Chien-Hua Chen, Corvallis, OR (US);
Michael W. Cumbie, Albany, OR (US);
Brett E. Dahlgren, Albany, OR (US);
Assignee:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/165 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/145 (2006.01);
U.S. Cl.
CPC ...
B41J 2/165 (2013.01); B41J 2/1404 (2013.01); B41J 2/14032 (2013.01); B41J 2/1603 (2013.01); B41J 2/1637 (2013.01); B41J 2/16579 (2013.01); B41J 2/145 (2013.01); B41J 2/1433 (2013.01); B41J 2002/14354 (2013.01);
Abstract
In an implementation, a printhead includes a printhead die molded into a molding. The die has a front surface exposed outside the molding to dispense fluid drops through nozzles and an opposing back surface covered by the molding except at a channel in the molding through which fluid may pass directly to the back surface. The die also has a nozzle health sensor molded into the molding to detect defective nozzles in the printhead die.