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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9770757 B1

PDFFull Text
Date of Patent:
Sep. 26, 2017

Filed:

Aug. 13, 2015

Method of making sound interface in overcast bimetal components

Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Qigui Wang, Rochester Hills, MI (US);

Bing Ye, Minhang, CN;

Haiyan Jiang, Minhang, CN;

Assignee:

GM GLOBAL TECHNOLOGY OPERATIONS LLC, Detroit, MI (US);

Attorney:
Primary Examiner:

Kevin P Kerns

Int. Cl.
CPC ...
B22D 19/00 (2006.01); B22D 19/16 (2006.01); B22D 25/06 (2006.01); C25D 5/44 (2006.01); C23C 22/66 (2006.01); C23C 22/78 (2006.01); C23C 22/83 (2006.01); C23F 1/36 (2006.01); B22D 19/04 (2006.01); B22D 21/00 (2006.01); C23G 1/02 (2006.01); C23G 1/12 (2006.01); C23G 1/22 (2006.01); C23G 1/24 (2006.01); C25D 5/50 (2006.01); C23C 18/54 (2006.01); C25D 3/18 (2006.01);
U.S. Cl.
CPC ...
B22D 25/06 (2013.01); B22D 19/0081 (2013.01); B22D 19/04 (2013.01); B22D 21/007 (2013.01); C23C 18/54 (2013.01); C23C 22/66 (2013.01); C23C 22/78 (2013.01); C23C 22/83 (2013.01); C23F 1/36 (2013.01); C23G 1/02 (2013.01); C23G 1/125 (2013.01); C23G 1/22 (2013.01); C23G 1/24 (2013.01); C25D 5/44 (2013.01); C25D 5/50 (2013.01); C25D 3/18 (2013.01);
Abstract

A method of forming a bi-metallic casting. The method includes providing a metal preform of a desired base shape defining a substrate surface and removing a natural oxide layer and surface contamination from the substrate surface to yield a cleaned metal preform. The method further includes galvanizing the cleaned metal preform, yielding a galvanized metal preform followed by electroplating a thin nickel film on at least a portion of the substrate surface of the galvanized metal preform. Additionally, the method includes metallurgically bonding the portion of the metal preform having the nickel film with an overcast metal to form a bi-metallic casting. The nickel film promotes a metallurgical bond between the metal preform and the overcast metal.

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