The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Oct. 04, 2013
Applicant:

Stryker Corporation, Kalamazoo, MI (US);

Inventors:

Robert Brindley, Delton, MI (US);

John Janik, Hudsonville, MI (US);

Edward Chia-Ning Tang, Ann Arbor, MI (US);

James Bernard Dunlop, Colorado Springs, CO (US);

Joseph Leland Spangler, Manitou Springs, CO (US);

Assignee:

STRYKER CORPORATION, Kalamazoo, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/05 (2006.01); A61N 1/08 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
A61N 1/05 (2013.01); A61N 1/0553 (2013.01); A61N 1/08 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/2101 (2013.01); H01L 2224/211 (2013.01); H01L 2224/215 (2013.01); H01L 2224/221 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15165 (2013.01); H01L 2924/15787 (2013.01); H05K 1/118 (2013.01); H05K 1/185 (2013.01);
Abstract

An implantable electrode array that includes a carrier on which multiple spaced apart electrodes are disposed. Embedded in the module are control modules. The control modules are contained in packages. Portions of the packages extend outwardly from the carrier so as to be disposed against adjacent surfaces of the carrier. The packages contain conductive tracts that provide conductive links from the conductors internal to the carrier to the packaged control modules.


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