The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Apr. 26, 2013
Applicant:
Daikin Industries, Ltd., Osaka-shi, Osaka, JP;
Inventors:
Junichi Teraki, Shiga, JP;
Akihiko Oguri, Shanghai, CN;
Assignee:
Daikin Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25D 23/12 (2006.01); H05K 7/20 (2006.01); F24F 1/24 (2011.01); F25B 31/00 (2006.01); H01L 23/473 (2006.01); H05K 1/02 (2006.01); F25B 13/00 (2006.01); H05K 3/22 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2029 (2013.01); F24F 1/24 (2013.01); F25B 31/006 (2013.01); H01L 23/473 (2013.01); H05K 1/02 (2013.01); H05K 1/0271 (2013.01); H05K 7/20936 (2013.01); F25B 13/00 (2013.01); F25B 2313/0254 (2013.01); F25B 2700/21153 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0203 (2013.01); H05K 3/22 (2013.01); H05K 3/306 (2013.01); H05K 3/3468 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09127 (2013.01); H05K 2201/10409 (2013.01); H05K 2203/044 (2013.01);
Abstract
A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.