The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Dec. 30, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Matthew A. Butterbaugh, Rochester, MN (US);

Eric A. Eckberg, Rochester, MN (US);

Camillo Sassano, Durham, NC (US);

Kevin L. Schultz, Raleigh, NC (US);

Scott A. Shurson, Mantorville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 7/14 (2006.01); H05K 7/18 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0221 (2013.01); H05K 5/0213 (2013.01); H05K 5/0247 (2013.01); H05K 7/14 (2013.01); H05K 7/1409 (2013.01); H05K 7/18 (2013.01); Y10T 29/49815 (2015.01); Y10T 29/49822 (2015.01);
Abstract

Modular elements removable from enclosures and employing cams forming detent features with latches are disclosed. A modular element may include a chassis body supporting electronic components. The modular element is removable from or secured to an enclosure using a latch. The latch may engage the enclosure and may remain engaged with the enclosure by being secured by interfacing with a cam. By forming the cam with a predetermined shape, a detent feature may be established with the latch to secure the latch and maintain the modular element locked to the enclosure. The latch may be disengaged from the cam by applying a disengagement motion to the cam and allow the latch to move relative to the chassis body and disengage from the enclosure. In this manner, the modular element is efficiently secured and removed from the enclosure with minimum obstruction to airflow to the electronic components.


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