The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Oct. 15, 2014
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Hideyuki Sagawa, Naka-gun, JP;
Keisuke Fujito, Mito, JP;
Takayuki Tsuji, Kitaibaraki, JP;
Kotaro Tanaka, Naka-gun, JP;
Hiromitsu Kuroda, Hitachi, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 3/28 (2006.01); H05K 3/06 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/282 (2013.01); H05K 3/06 (2013.01); H05K 3/244 (2013.01); H05K 2201/0341 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0315 (2013.01); H05K 2203/087 (2013.01); Y10T 29/49162 (2015.01);
Abstract
A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.