The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Jun. 05, 2015
Applicant:
Tyco Electronics Amp Korea Ltd, Gyungsangbuk-do, KR;
Inventors:
Yang Yoon Choi, Gyunsangbuk-do, KR;
Ok Ky Beak, Siheung-si, KR;
Assignee:
Tyco Electronics AMP Korea Ltd., Gyungsangbuk-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); C25D 5/02 (2006.01); C23C 18/16 (2006.01); C23C 18/54 (2006.01); H05K 3/38 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); C23C 18/1637 (2013.01); C23C 18/1653 (2013.01); C23C 18/54 (2013.01); C25D 5/02 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/06 (2013.01); H05K 3/429 (2013.01); H05K 3/462 (2013.01); H05K 3/4602 (2013.01); H05K 3/467 (2013.01); H05K 1/0206 (2013.01); H05K 1/0251 (2013.01); H05K 3/0094 (2013.01); H05K 3/386 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/095 (2013.01); H05K 2203/072 (2013.01); H05K 2203/073 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/1476 (2013.01);
Abstract
A printed circuit board has a double-sided substrate with an insulation layer, a bonding member, a base layer of an aluminum material, and a circuit pattern; a second insulation layer; a second bonding member; a second base layer; a through hole; a zinc substitution layer; a plating layer; and a second circuit pattern.