The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Jul. 31, 2013
Applicants:

Horiba, Ltd., Kyoto-shi, Kyoto, JP;

Politecnico Di Milano, Milan, IT;

Inventors:

Carlo Fiorini, Milan, IT;

Luca Bombelli, Milan, IT;

Assignees:

HORIBA, LTD., Kyoto, JP;

POLITECNICO DI MILANO, Milan, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03F 1/26 (2006.01); H03F 3/70 (2006.01); H03F 3/45 (2006.01); G01T 1/17 (2006.01); G01T 1/24 (2006.01); H03F 3/08 (2006.01);
U.S. Cl.
CPC ...
H03F 1/26 (2013.01); G01T 1/17 (2013.01); G01T 1/24 (2013.01); H03F 3/08 (2013.01); H03F 3/45475 (2013.01); H03F 3/70 (2013.01); H03F 2200/261 (2013.01); H03F 2200/372 (2013.01); H03F 2200/411 (2013.01); H03F 2203/45512 (2013.01); H03F 2203/45514 (2013.01); H03F 2203/45536 (2013.01);
Abstract

In a preamplifier (amplifier) for the radiation detector, an interconnection layer connected to the bonding pad forms one electrode of a feedback capacitor. Since there is no wiring for connecting the bonding pad and capacitor, a parasitic capacitance caused by the wiring will not be generated. Moreover, the capacitor is arranged below the bonding pad with a conductive layer serving as the other electrode, so that the feedback capacitance of the capacitor is included in the parasitic capacitance between the interconnection layer and the substrate. Compared to the conventional case, an amount of capacitance corresponding to the parasitic capacitance caused by wiring and the feedback capacitance for the capacitor is reduced from the input capacitance. Thus, the input capacitance for the amplifying circuit is reduced.


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