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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9768372 B1

PDFFull Text
Date of Patent:
Sep. 19, 2017

Filed:

Sep. 03, 2014

Semiconductor device, superconducting device, and manufacturing method of semiconductor device

Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Hisao Miyazaki, Yokohama, JP;

Yuichi Yamazaki, Inagi, JP;

Tadashi Sakai, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

William Coleman

Int. Cl.
CPC ...
H01L 39/24 (2006.01); H01L 29/861 (2006.01); H01L 29/868 (2006.01); H01L 39/22 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 29/16 (2006.01); H01L 21/02 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
H01L 39/2493 (2013.01); H01L 21/02381 (2013.01); H01L 21/02439 (2013.01); H01L 21/02444 (2013.01); H01L 21/02458 (2013.01); H01L 21/02499 (2013.01); H01L 21/02507 (2013.01); H01L 21/02521 (2013.01); H01L 21/02664 (2013.01); H01L 29/1606 (2013.01); H01L 29/6603 (2013.01); H01L 29/66045 (2013.01); H01L 29/7781 (2013.01); H01L 29/868 (2013.01); H01L 29/8611 (2013.01); H01L 39/223 (2013.01); H01L 29/84 (2013.01);
Abstract

A semiconductor device of an embodiment includes a layered substance formed by laminating two-dimensional substances in two or more layers. The layered substance includes at least either one of a p-type region having a first intercalation substance between layers of the layered substance and an n-type region having a second intercalation substance between layers of the layered substance. The layered substance includes a conductive region that is adjacent to at least either one of the p-type region and the n-type region. The conductive region includes neither the first intercalation substance nor the second intercalation substance. A sealing member is formed on the conductive region, or on the conductive region and an end of the layered substance.

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