The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Sep. 14, 2016
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Michael Fehrer, Bad Abbach, DE;

Alfred Lell, Maxhütte-Haidhof, DE;

Martin Müller, Bernhardswald, DE;

Tilman Schlenker, Nittendorf, DE;

Sönke Tautz, Tegernheim, DE;

Uwe Strauβ, Bad Abbach, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/0216 (2014.01); H01L 31/18 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01S 5/02 (2006.01); H01S 5/20 (2006.01); H01S 5/028 (2006.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 24/24 (2013.01); H01L 24/48 (2013.01); H01L 24/82 (2013.01); H01L 31/0203 (2013.01); H01L 31/02019 (2013.01); H01L 31/02161 (2013.01); H01L 31/186 (2013.01); H01L 33/0095 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/484 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10336 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0025 (2013.01); H01S 5/02 (2013.01); H01S 5/028 (2013.01); H01S 5/20 (2013.01); H01S 2301/176 (2013.01);
Abstract

An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material directly applied by atomic layer deposition, wherein the semiconductor component is applied on a carrier, the carrier includes electrical connection layers, the semiconductor component electrically connects to one of the electrical connection layers via an electrical contact element, and the sealing material completely covers in a hermetically impermeable manner and directly contacts all exposed surfaces including sidewall and bottom surfaces of the semiconductor component and the electrical contact element and all exposed surfaces of the carrier apart from an electrical connection region of the carrier.


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