The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Aug. 31, 2015
Applicant:

Sandisk Technologies Inc., Plano, TX (US);

Inventors:

Marika Gunji-Yoneoka, Sunnyvale, CA (US);

Atsushi Suyama, San Jose, CA (US);

Kensuke Yamaguchi, Kuwana, JP;

Hiroyuki Kinoshita, San Jose, CA (US);

Raghuveer S. Makala, Campbell, CA (US);

Rahul Sharangpani, Fremont, CA (US);

Shigehisa Inoue, Yokkalchi, JP;

Tuan Pham, San Jose, CA (US);

Assignee:

SANDISK TECHNOLOGIES LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/34 (2006.01); H01L 29/51 (2006.01); H01L 21/28 (2006.01); H01L 21/3213 (2006.01); H01L 21/311 (2006.01); H01L 27/11556 (2017.01); H01L 29/06 (2006.01); H01L 21/3205 (2006.01); H01L 21/02 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 29/517 (2013.01); H01L 21/0209 (2013.01); H01L 21/02087 (2013.01); H01L 21/28273 (2013.01); H01L 21/31111 (2013.01); H01L 21/32051 (2013.01); H01L 21/32134 (2013.01); H01L 27/11556 (2013.01); H01L 29/0649 (2013.01); H01L 21/28282 (2013.01); H01L 27/11582 (2013.01);
Abstract

Undesirable metal contamination from a selective metal deposition process can be minimized or eliminated by employing a first material layer on a bevel and a back side of a substrate, while providing a second material layer only on a front side of the substrate. The first material layer and the second material layer are selected such that a selective deposition process of a metal material provides a metal material portion only on the second material layer, while no deposition occurs on the first material layer or isolated islands of the metal material are formed on the first material layer. Any residual metal material can be removed from the bevel and the back side by a wet etch to reduce or prevent metal contamination from the deposited metal material.


Find Patent Forward Citations

Loading…