The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Jul. 22, 2016
Applicants:

Emmett Howard, Tempe, AZ (US);

Nicholas Munizza, Gilbert, AZ (US);

Paul Yee, Chandler, AZ (US);

Inventors:

Emmett Howard, Tempe, AZ (US);

Nicholas Munizza, Gilbert, AZ (US);

Paul Yee, Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/20 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 21/4853 (2013.01); H01L 21/6835 (2013.01); H01L 21/2007 (2013.01); H01L 21/52 (2013.01); H01L 51/0097 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01);
Abstract

Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.


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