The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Nov. 25, 2016
Nippon Soken, Inc., Nishio, Aichi, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Tomo Sasaki, Toyota, JP;
Akio Kitami, Toyota, JP;
Tadafumi Yoshida, Kasugai, JP;
Masataka Deguchi, Nagoya, JP;
Kazunori Uchiyama, Okazaki, JP;
Naoki Hakamada, Anjo, JP;
NIPPON SOKEN, INC., Nishio, Aichi, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, Aichi-ken, JP;
Abstract
A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.