The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Feb. 29, 2012
Applicant:
Azhar Aripin, Subang Jaya, MY;
Inventor:
Azhar Aripin, Subang Jaya, MY;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 21/4821 (2013.01); H01L 23/4951 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 24/97 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/181 (2013.01); Y10T 29/49117 (2015.01);
Abstract
In one embodiment, an electronic package structure includes multiple rows of I/O pads and is formed without a flag portion. An electronic device may be attached to a pair of adjacent inner rows of I/O pads. The pair of adjacent inner rows of I/O pads is configured to support, at least in part, the electronic device, and to receive connective structures, such as wire bonds. Connective structures may electrically connect the electronic device to the multiple rows of I/O pads, and an encapsulating layer covers portions of the I/O pads, the electronic device and the connective structures.