The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

May. 06, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Chet Vernon Lenox, Venus, TX (US);

Seung-Chul Song, Plano, TX (US);

Brian K. Kirkpatrick, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 31/119 (2006.01); H01L 21/8238 (2006.01); H01L 21/8234 (2006.01); H01L 27/092 (2006.01); H01L 21/02 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823864 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/823468 (2013.01); H01L 21/823828 (2013.01); H01L 21/823857 (2013.01); H01L 27/092 (2013.01); H01L 27/0928 (2013.01); H01L 29/401 (2013.01); H01L 29/42364 (2013.01); H01L 29/42368 (2013.01); H01L 29/42376 (2013.01); H01L 29/66545 (2013.01); H01L 29/66553 (2013.01);
Abstract

An integrated circuit is formed by removing a sacrificial gate dielectric layer and a sacrificial gate to form a gate cavity. A conformal dielectric first liner is formed in the gate cavity and a conformal second liner is formed on the first liner. A first etch removes the second liner from the bottom of the gate cavity, leaving material of the second liner on sidewalls of the gate cavity. A second etch removes the first liner from the bottom of the gate cavity exposed by the second liner, leaving material of the first liner on the bottom of the gate cavity under the second liner on the sidewalls of the gate cavity. A third etch removes the second liner from the gate cavity, leaving an L-shaped spacers of the first liner in the gate cavity. A permanent gate dielectric layer and replacement gate are formed in the gate cavity.


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